Product Information
HDI-6L6-Layers Mobile PCB
Description
Materials: FR-4 + RCC
Thickness: 0.8mm
Surface processing: immersion gold
Laser drill hole (minimum): 0.1mm
Buried and blind via structure: L1-L2,L2-L5,L5-L6
Minimum line space: 0.1mm
Minimum line width: 0.089mm
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